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(Download) "Self-Organized 3D Integrated Optical Interconnects" by Tetsuzo Yoshimura " eBook PDF Kindle ePub Free

Self-Organized 3D Integrated Optical Interconnects

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eBook details

  • Title: Self-Organized 3D Integrated Optical Interconnects
  • Author : Tetsuzo Yoshimura
  • Release Date : January 08, 2021
  • Genre: Physics,Books,Science & Nature,Professional & Technical,Engineering,Electrical Engineering,Life Sciences,
  • Pages : * pages
  • Size : 74163 KB

Description

Currently, light waves are ready to come into boxes of computers in high-performance computing systems like data centers and super computers to realize intra-box optical interconnects. For inter-box optical interconnects, light waves have successfully been introduced by OE modules, in which discrete bulk-chip OE/electronic devices are assembled using the flip-chip-bonding-based packaging technology. OE modules, however, are not applicable to intra-box optical interconnects, because intra-box interconnects involve “short line distances of the cm–mm order” and “large line counts of hundreds-thousands.” This causes optics excess, namely, excess components, materials, spaces, fabrication efforts for packaging, and design efforts. The optics excess raises sizes and costs of intra-box optical interconnects enormously when they are built using conventional OE modules.

This book proposes the concept of self-organized 3D integrated optical interconnects and the strategy to reduce optics excess in intra-box optical interconnects.


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